Dianyang
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The standout capability of the CA-09D is its ability to identify the exact location of leakage currents and short circuits on a circuit board in seconds. Instead of manually probing dozens of test points with a multimeter, technicians simply place the board under the analyzer and trigger a single scan. The system highlights abnormal thermal signatures caused by current leakage—detectable from as low as 6mA—allowing repair teams to address the root cause directly rather than spending valuable time on trial-and-error troubleshooting.
Beyond flat 2D heat maps, the CA-09D renders the entire board's temperature distribution as an interactive 3D thermal field. This volumetric representation makes it immediately obvious which components run hottest, how heat propagates across the PCB surface, and whether thermal management elements such as heatsinks and copper pours are performing as intended. Engineers can rotate and zoom into the 3D model to study thermal gradients around specific ICs, capacitors, and power regulators.
Quality control workflows often require comparing a suspect board against a known-good reference. The CA-09D supports side-by-side dual-board thermal comparison, overlaying the thermal profiles of two boards to reveal even subtle temperature discrepancies. This is particularly valuable for identifying borderline-defective units that still function but exhibit abnormal heating patterns—catching potential field failures before they reach customers.
The CA-09D offers two complementary ways to work. Connect via USB Type-C to a Windows 10 PC running the standard analysis software for comprehensive thermal diagnostics, including detailed temperature profiling, 3D field rendering, and report generation. Alternatively, use the Android app on a smartphone or tablet for on-the-go inspections where a full desktop setup is impractical. Both platforms support automatic firmware updates, ensuring the analyzer stays current with the latest features.
Unlike bulky benchtop instruments that are anchored to a single workstation, the CA-09D features an innovative foldable frame that collapses to a compact 150 × 150 × 80 mm—roughly the size of a thick book. When deployed, it opens to 150 × 150 × 165 mm, providing a stable platform for board inspection at any desk or workbench. This design makes it equally practical for repair shops, field service calls, and on-site factory audits.
When board-level overview is not enough, the CA-09D accepts a snap-on macro lens that brings the observation distance down to 30 mm, revealing thermal details at the individual component level. This is ideal for examining densely populated areas, fine-pitch ICs, and BGA packages where heat concentration may indicate solder joint issues or internal die defects. The macro lens attaches via a fixed clip mechanism—no tools required—and can be removed just as quickly for wider field-of-view scanning.
The CA-09D covers an exceptionally broad temperature span of -15°C to 600°C (5°F to 1112°F), accommodating everything from cryogenic testing of cooling systems to high-temperature power electronics evaluation. Measurement accuracy is rated at ±2°C or ±2% of reading (whichever is greater) under standard lens operation, providing dependable data across the full range. This versatility means a single instrument can serve multiple departments—from R&D prototyping to production-line quality control.
| Parameter | Specification |
| IR Resolution | 256 × 192 pixels |
| Frame Rate | 25 Hz |
| Field of View | 56° (H) × 42° (V) |
| Measurement Range | -15°C ~ +600°C |
| Measurement Accuracy | ±2°C or ±2% of reading (without macro lens) |
| Macro Lens | Fixed clip-on type |
| Measurement Distance | 100 mm ~ 150 mm (30 mm with macro lens) |
| Interface | USB Type-C |
| Dimensions (Folded) | 150 mm × 150 mm × 80 mm |
| Dimensions (Deployed) | 150 mm × 150 mm × 165 mm |
| Operating Temperature | 0°C ~ 50°C |
| Storage Temperature | -20°C ~ 60°C |
| Humidity | < 95% RH |
| Software | Standard analysis software (Win10), Android App |
| Software Functions | Quick leak point ID, high-temp rapid scan, point/line/area measurement, 3D thermal field, dual-board comparison, over-temp alarm |
| Image/Video Format | Photos: JPG | Videos: MP4 |
The analyzer uses high-resolution infrared thermal imaging to scan circuit boards in real time. It automatically identifies and highlights abnormal thermal signatures caused by current leakage (as low as 6mA) or short circuits with a single click, eliminating manual multimeter probing.
The CA-09D features an exceptionally broad temperature measurement range from -15°C to 600°C (-5°F to 1112°F) with a measurement accuracy rated at ±2°C or ±2% of the reading under standard lens operation.
Yes, with the optional snap-on macro lens attached via a tool-free fixed clip, the observation distance drops to 30 mm, allowing detailed inspection of micro components, fine-pitch ICs, and BGA packages.
The device supports dual operation modes: full feature standard thermal analysis software on Windows 10 via USB Type-C connection, and a mobile application for Android smartphones or tablets for quick field inspections.
Dual-board comparison overlays the thermal profile of a suspect PCB against a known-good reference board. This side-by-side analysis quickly exposes subtle temperature variances, helping technicians catch borderline defects before units ship.
Yes, it features an innovative book-style foldable design that collapses down to a compact 150 × 150 × 80 mm for easy transport in field service calls, lab benches, or manufacturing plants.
