High-Quality CA-30D Professional Thermal Analyzer Pricelist, Manufacturers

The CA-30D is a professional-tier benchtop thermal analyzer built around a 384×288 infrared detector with sub-50mK thermal sensitivity. Designed for laboratory-grade thermal characterization, it bridges the gap between handheld inspection cameras and expensive research instruments—delivering scientific analysis capabilities at a practical price point. Equipped with a powerful PC-based software suite, the CA-30D captures full radiometric video, performs multi-dimensional data correlation, and supports external sensors for synchronized temperature, voltage, and current measurement. It is the instrument of choice for R&D labs evaluating thermal management solutions, semiconductor behavior, and material performance under varying load conditions. 

Product Description

Product Information

Scientific-Grade Analysis Software

At the heart of the CA-30D is a comprehensive software platform that transforms raw thermal data into actionable engineering insight. Accessed via USB connection to a Windows PC, the software provides an extensive toolkit: real-time and offline video analysis, temperature curves, isothermal mapping, point/line/polygon measurement zones, and Excel data export. Users can define multiple measurement regions with independently adjustable emissivity settings—critical when analyzing boards that combine metallic traces, ceramic packages, and plastic connectors on the same surface.
Scientific-Grade Analysis Software

Optional Macro Lens for 50μm-Level Detection

When standard resolution is insufficient for fine-pitch component analysis, the CA-30D accepts a dedicated macro lens that enables detection of targets as small as 50 micrometers. At this magnification, individual IC pins, wire bonds, and micro-vias become thermally visible—making it possible to study heat generation at the die level, evaluate solder joint integrity, and characterize thermal behavior of miniature components such as 0201 resistors and fine-pitch QFN packages.
Optional Macro Lens

3D Thermal Field Visualization

Beyond flat 2D heat maps, the CA-30D renders the entire board's temperature distribution as an interactive 3D thermal field. This volumetric representation makes it immediately obvious which components run hottest, how heat propagates across the PCB surface, and whether thermal management elements such as heatsinks and copper pours are performing as intended. Engineers can rotate and zoom into the 3D model to study thermal gradients around specific ICs, capacitors, and power regulators.
3D Thermal Field Visualization

Multi-Dimensional Data Correlation

Thermal behavior rarely exists in isolation—it is driven by electrical load, ambient conditions, and material properties. The CA-30D addresses this reality by supporting simultaneous connection of external USB sensors, including environmental temperature probes and load power meters. The software plots voltage, current, and temperature curves on a common timeline, allowing engineers to identify causal relationships such as current spikes triggering localized heating, or ambient temperature drift affecting measurement baselines.
Multi-Dimensional Data Correlation

Multi-curve Analysis

The CA-30D Thermal Analyzer features powerful multi-curve analysis capability. It can simultaneously collect temperature data from measurement points, measurement lines and temperature-measuring regions. Multiple curves are displayed synchronously to visually compare and track temperature-change trends of multiple targets. It facilitates quick evaluation of thermal steady-state and heat fluctuation, enabling efficient thermal-performance analysis for electronic devices and heat-dissipation materials.
Multi-curve Analysis

Stable Multi-Angle Adjustable Frame

Precision thermal analysis requires mechanical stability and flexible positioning. The CA-30D is mounted on a robust stand system with multi-axis adjustment, allowing the sensor head to be oriented at virtually any angle relative to the test subject. Manual focus control provides fine-tuned clarity at any distance from 40 mm to 2000 mm.
Stable Multi-Angle Adjustable Frame

High-Definition Thermal Imaging for IC Inspection

The 384×288 detector combined with the 9.1 mm standard lens produces thermal images with sufficient detail to distinguish individual IC package pins and surrounding thermal patterns. This level of clarity is essential for diagnosing issues such as cold solder joints, BGA packages with internal delamination, or power MOSFETs running hotter than their rated specifications.
High-Definition Thermal Imaging

High-Temperature Alarm

The CA-30D Thermal Analyzer is equipped with a practical high temperature alarm function. After enabling the temperature alarm switch, the buzzer will sound an audible alert when the detected temperature exceeds the preset threshold; meanwhile, a red border flashes around the target area on the screen. Featuring dual audio-visual alarm, it rapidly identifies abnormal temperature rise, helping operators spot overheating risks in a timely manner and making thermal-test operations safer and more reliable.
High-Temperature Alarm
Specification
Parameter Value
IR Resolution 384 × 288 pixels
Spectral Range 8 ~ 14 μm
Thermal Sensitivity (NETD) < 50 mK @ 25°C
Field of View 29.2° (H) × 21.7° (V)
IFOV 1.3 mrad
Frame Rate 25 Hz
Focus Manual
Measurement Range -20°C ~ 550°C
Measurement Accuracy

-20~120°C: ±2°C/±2%

120~550°C: ±3°C/±3%

Measurement Modes Max, min, average
Optimal Distance 40 ~ 2000 mm
Macro Lens (Optional) Working distance: 50 ~ 80 mm
Emissivity 0.1 ~ 1.0 (adjustable)
Image File Full radiometric JPG
Radiometric Recording .dyv (analysis software)
Min Sampling Interval 40 ms
Operating Temperature -10°C ~ +55°C
External Devices USB temp sensor, USB power meter
Software Functions Temp curves, isothermal lines, 3D thermal field, point/line/polygon measurement, temp alarms, Excel export, full radiometric video
Frequently Asked Questions
Q: What is the thermal resolution and accuracy of the CA-30D thermal analyzer?
A: The CA-30D features an IR resolution of 384 × 288 pixels with a thermal sensitivity (NETD) of < 50 mK @ 25°C. Its measurement range spans from -20°C to 550°C, delivering an accuracy of ±2°C or ±2% for temperatures between -20°C and 120°C.
Q: Can the CA-30D detect micro-level thermal anomalies on small components?
A: Yes, with the optional dedicated macro lens (working distance of 50 ~ 80 mm), the analyzer can detect thermal targets down to 50 micrometers. This enables inspection of small IC pins, wire bonds, micro-vias, and 0201 components.
Q: How does the 3D thermal field feature assist in PCB thermal evaluation?
A: The 3D thermal field transforms flat 2D maps into volumetric temperature distributions. This visual representation allows engineers to easily identify component peak temperatures, examine heat propagation across PCB surfaces, and analyze the performance of heatsinks and copper pours.
Q: Does the software support simultaneous multi-curve temperature tracking?
A: Yes, the platform collects temperature data from points, lines, and regional zones simultaneously, generating real-time synchronous curves to evaluate steady-state thermal behavior and rapid temperature fluctuations.
Q: How does the dual audio-visual high-temperature alarm alert operators?
A: Once a preset temperature threshold is breached, the analyzer activates a built-in buzzer sound while flashing a clear red border around the target zone on-screen, ensuring rapid hazard recognition.
Q: Can external instruments be synchronized with the thermal software?
A: Yes, external USB devices such as environmental temperature probes and load power meters can be connected. The software correlates voltage, current, and thermal data on a unified timeline for comprehensive testing.

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