Explore our high-precision infrared imaging hardware available for OEM/ODM integration and global wholesale distribution.
How smartphone-integrated thermal sensors are replacing traditional standalone inspection tools in modern enterprise procurement workflows.
Detailed engineering matrix evaluating handheld standalone thermal units vs. smartphone-connected thermal imaging modules for enterprise B2B buyers.
| Model Series | Detector Type | IR Resolution | Temp Range | NETD Sensitivity | Primary Interface | Ideal Application |
|---|---|---|---|---|---|---|
| H1FB Series | Uncooled VOx Microbolometer | 160 × 120 | -20°C to 150°C / 550°C | <50 mK @ 25°C | USB Type-C / Lightning | Building Audits, Mobile HVAC Repair |
| H2FB Series | Uncooled VOx Microbolometer | 256 × 192 | -20°C to 550°C | <40 mK @ 25°C | USB Type-C (Android / iOS) | Electrical Diagnostics, PCB Inspections |
| DP-12DV / 25DV | Dual-Light Fusion Module | 120×90 / 256×192 | -20°C to 550°C | <50 mK | Handheld Ergonomic Unit | Industrial Maintenance, Facilities |
| DP-38D Professional | High-Res VOx Array | 384 × 288 | -20°C to 650°C | <40 mK | Handheld Standalone Display | Substation Monitoring, Security |
| DP-64D Ultra-High Res | Military-Grade VOx Matrix | 640 × 512 | -20°C to 1200°C | <35 mK | Multi-Interface Export Unit | Refinery, Metallurgical, Aerospace |
| CA-30D Analyzer | Precision Optical Bench | 384 × 288 / Custom | -10°C to 300°C | <30 mK | USB 3.0 / PC Suite Software | Electronics R&D, PCB Thermal Profiling |
Deployment scenarios for mobile phone thermal imagers and high-precision infrared analyzers across key international industries.
World-Class R&D, State-of-the-Art Manufacturing, and Certified Quality Management
Shenzhen Dianyang Technology Co., Ltd. is a subsidiary of VHD (Shenzhen VHD Technology Co., Ltd.), a publicly listed company on the Shenzhen Stock Exchange. This strategic affiliation gives Dianyang unique access to VHD’s advanced R&D platforms, high-precision manufacturing systems, and rigorous quality management practices—enabling us to deliver thermal imaging products of higher reliability and consistency than typical ODMs.
We specialize in ODM/OEM services for infrared thermal imaging solutions, including handheld thermal imagers, smartphone-connected thermal cameras, thermal analyzers, and thermal imaging telescopes. Our products serve global customers in power inspection, building diagnostics, firefighting, industrial maintenance, and outdoor applications.
Our dedicated engineering team applies Design for Manufacturing (DFM), Design for Testability (DFT), thermal simulation, and EMC pre-compliance analysis to optimize performance and accelerate development. We also support clients in obtaining key certifications such as CE, FCC, RoHS, REACH, CB, UKCA, KC, and PSE.
Rigorous regulatory adherence ensuring smooth international customs clearance and local market deployment.
Pioneering the next generation of micro-infrared vision, edge AI analytics, and wafer-level packaging.
Transitioning sensor focal plane arrays (FPAs) to sub-12 micron pixel pitch using Wafer-Level Packaging (WLP). This drastically scales down module dimensions and lowers cost while maintaining high sensitivity (<30mK NETD).
Integrating Neural Processing Units (NPUs) directly into mobile thermal dongles. Automatic real-time target recognition, automatic anomaly highlighting, electrical arc detection, and predictive thermal degradation warnings right on the smartphone edge.
Blending high-definition visible light cameras, short-wave infrared (SWIR), and long-wave infrared (LWIR) in real time to generate ultra-sharp detail overlays (MSX technology equivalent) for high-end professional inspections.
Expert insights regarding procurement, technical capabilities, mobile phone compatibility, and OEM/ODM engineering customization.
Browse our complete catalog of industrial handheld thermal cameras, mobile thermal imagers, and benchtop thermal analyzers.
Dianyang
