High-resolution uncooled focal plane array (UFPA) thermal cores and systems tailored for harsh continental climates, high ambient temperature operating ranges, and rigorous diagnostic duties.
Navigating the rapid expansion of Central Asia’s manufacturing hub under the "Uzbekistan - 2030" Strategy with robust, climate-resilient infrared modules.
As the economic powerhouse of Central Asia, Uzbekistan is undergoing an unprecedented phase of industrial modernization, smart infrastructure construction, and renewable energy adoption. Major industrial complexes across Tashkent, Samarkand, Navoi, Almalyk, and the Fergana Valley are upgrading their technological infrastructure to meet international automation and security standards.
Operating thermal imaging systems in Central Asia presents unique physical and environmental challenges. Uzbekistan experiences an extreme continental climate: summer temperatures in arid zones such as the Kyzylkum Desert frequently surpass +45°C to +50°C, driving immense thermal stress on electrical power grids, gas compressor stations, and heavy machinery. Conversely, severe winter drops to -20°C require thermal sensor cores with exceptional temperature compensation algorithms, zero drift, and robust uncooled focal plane array (UFPA) calibration.
Shenzhen Dianyang Technology Co., Ltd., backed by parent enterprise VHD (Shenzhen VHD Technology Co., Ltd. — listed on the Shenzhen Stock Exchange), provides Uzbekistan’s system integrators, public utilities, defense contractors, and industrial OEMs with military-grade and high-precision commercial Thermal Imaging Modules. Our solutions deliver exceptional Information Gain through enhanced radiometric precision, low power consumption, and seamless interface integration (MIPI, USB-C, DVP, RTSP, and Ethernet).
How cutting-edge Vanadium Oxide (VOx) microbolometers and AI Edge Computing are defining the next decade of thermal vision technology.
Transitioning from legacy 17μm pitch architectures to 12μm and emerging 8μm wafer-level package (WLP) VOx detectors. This allows ultra-compact module sizes while improving optical clarity and spatial resolution across long ranges.
On-module SoC AI chips that perform real-time thermal object classification, automatic hot-spot detection, perimeter breach identification, and predictive maintenance alerts without burdening host controllers.
Hardware-level pixel fusion combining Long-Wave Infrared (LWIR 8-14μm) thermal channels with high-definition optical sensors. This provides sharp context overlays and crisp edges for critical security and industrial inspection.
Comprehensive application frameworks designed to solve specific operational bottlenecks in Central Asia’s growing industrial hubs.
Uzbekistan’s power grid (operated under National Electric Grids of Uzbekistan) is expanding rapidly with high-voltage substations connecting regional industrial zones. Thermal imaging cores installed on fixed pan-tilt units or inspection drones perform autonomous thermographic scanning of transformers, circuit breakers, and transmission lines.
Home to the colossal Muruntau gold mine and major metallurgy plants in Navoi and Almalyk, Uzbekistan’s mining sector requires continuous thermal monitoring of conveyor belts, blast furnaces, ball mills, and heavy hauling equipment under dense dust conditions.
Uzbekistan serves as a vital gas transit corridor (including the Central Asia–China pipeline). Natural gas compressor stations and processing facilities in Bukhara and Gazli rely on thermal vision cores to detect gas flare temperatures, insulation breakdown, and pump bearing overheating.
With Uzbekistan’s target to scale solar energy capacity beyond 5GW by 2030 (projects in Navoi, Samarkand, and Surkhandarya), airborne radiometric inspection using light thermal camera cores has become essential.
Compare core specifications to choose the optimal infrared sensor engine for your custom hardware application.
| Module Series | IR Resolution | Pixel Pitch | NETD Sensitivity | Temperature Range | Primary Interface | Target Application |
|---|---|---|---|---|---|---|
| MD-64CA Series | 640 × 512 | 12 μm VOx | < 35 mK | -20°C to +550°C (Ext. 1200°C) | DVP / MIPI / USB 2.0 | High-end Security, UAV Payloads, Grid Auditing |
| DP-25DR / 25DV Series | 256 × 192 | 12 μm VOx | < 40 mK | -20°C to +550°C | USB-C / Type-C / SPI | Handheld Diagnostic Tools, Dual-Vision Cameras |
| DP-12D Series | 120 × 90 | 17 μm VOx | < 50 mK | -20°C to +350°C | Laser Ranging + Digital Out | Compact HVAC Inspection, Electrical Troubleshooting |
| DP-09D Series | 96 × 96 | 17 μm VOx | < 50 mK | -20°C to +550°C | Parallel / SPI | Cost-Effective OEM Sensors, Smart Home HVAC |
| H2F6B Mobile Series | 256 × 192 | 12 μm VOx | < 40 mK | -20°C to +550°C | Android USB-C Direct | Field Engineer Smartphones & Mobile Testing |
A Publicly Listed Subsidiary Ecosystem Delivering World-Class Thermal Imaging Hardware and OEM/ODM Services to Uzbekistan and Global Markets.
Shenzhen Dianyang Technology Co., Ltd. is a subsidiary of VHD (Shenzhen VHD Technology Co., Ltd.), a publicly listed company on the Shenzhen Stock Exchange. This strategic affiliation gives Dianyang unique access to VHD’s advanced R&D platforms, high-precision manufacturing systems, and rigorous quality management practices—enabling us to deliver thermal imaging products of higher reliability and consistency than typical ODMs.
We specialize in ODM/OEM services for infrared thermal imaging solutions, including handheld thermal imagers, smartphone-connected thermal cameras, thermal analyzers, and thermal imaging telescopes. Our products serve global customers in power inspection, building diagnostics, firefighting, industrial maintenance, and outdoor applications.
Our dedicated engineering team applies Design for Manufacturing (DFM), Design for Testability (DFT), thermal simulation, and EMC pre-compliance analysis to optimize performance and accelerate development. We also support clients in obtaining key international certifications such as CE, FCC, RoHS, REACH, CB, UKCA, KC, and PSE.
Explore our wide selection of mobile thermal attachments, handheld thermographic cameras, and specialized OEM core modules.
Expert answers regarding integration SDKs, customs logistics, environmental durability, and warranty for Uzbekistan buyers.
Our VOx microbolometer cores incorporate advanced thermal compensation hardware and real-time NUC (Non-Uniformity Correction) algorithms. They operate stably from -20°C up to +60°C ambient temperatures without drift, ensuring radiometric accuracy across desert environments in Navoi and Bokhara.
Yes! We provide complete Software Development Kits (SDKs) for Windows, Linux, Android, and iOS. The SDK supports raw temperature data output, palette adjustments, thermal image stream grabbing, and point/line/area temperature measurement callbacks.
Standard sample orders are dispatched within 3–7 business days via express air freight (DHL/FedEx/UPS directly to Tashkent International Airport). For OEM bulk shipments, we provide complete shipping documents including CO (Certificate of Origin), CE/FCC certificates, and HS code declarations to ensure smooth clearance through Uzbekistan State Customs.
As a specialized OEM/ODM manufacturer, our engineering team offers end-to-end design for manufacturing (DFM). We offer focal lengths ranging from 3.2mm up to 50mm Germanium optics, tailored IP rating enclosures, and PCB dimension modifications to fit your precise hardware shell.
All Dianyang thermal products are certified under CE, FCC, RoHS, and REACH. Select series also comply with CB, UKCA, KC, and PSE standards, ensuring full conformity with Uzbekistan's national technical standards (O'z DSt) and international safety norms.
We provide a 12-month to 24-month comprehensive factory warranty on all thermal cores and devices. Dedicated FAE (Field Application Engineer) support is available online 24/7 to assist your technical team during hardware design, SDK compilation, and field calibration.
Partner with Shenzhen Dianyang Technology (VHD Group) for high-performance thermal imaging modules, competitive factory-direct pricing, and comprehensive OEM/ODM engineering support.
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