Explore our flagship thermal camera solutions engineered for seamless OEM integration, multi-scenario deployment, and high-accuracy radiometric measurements.
In the rapidly evolving ecosystem of non-contact temperature measurement and advanced machine vision, OEM Thermal Imaging Sensor Modules have transformed from specialized military optics into foundational components for industrial automation, predictive maintenance, consumer electronics, and smart city infrastructure. Modern global enterprises require non-cooled Long-Wave Infrared (LWIR) cores that offer uncompromised radiometric accuracy, ultra-low power consumption, miniaturized footprints, and seamless software SDK integration.
As a leading provider of thermal imaging technology, Shenzhen Dianyang Technology Co., Ltd. bridge the gap between chip-level infrared detection and field-ready industrial systems. Leveraging our strategic alignment with listed parent group VHD, we deliver high-performance microbolometer cores—spanning standard resolutions from 96x96 to ultra-high 640x512—engineered specifically for system integrators, device manufacturers, and original equipment manufacturers worldwide.
Featuring NETD (Noise Equivalent Temperature Difference) < 40mK (optionally < 30mK), our LWIR sensor modules discern minute temperature differentials, ensuring early detection of thermal anomalies in high-voltage grids and micro-electronics.
Utilizing state-of-the-art VOx (Vanadium Oxide) WLP technology, our sensor modules achieve extremely compact form factors with minimal weight, making them ideal for mobile phone attachments, handheld devices, and UAV payloads.
Fully supported by cross-platform SDKs (Android, iOS, Windows, Linux, Embedded C/C++), enabling OEM engineering teams to rapidly embed thermal analytics, temperature alarms, and dual-light fusion algorithms into host platforms.
Our robust supply chain, automated SMT fabrication lines, and stringent quality control protocols deliver industry-leading yield rates and reliability metrics.
When global enterprise buyers, system integrators, and Fortune 500 equipment manufacturers evaluate thermal sensor modules for mass-market deployment, procurement decisions extend beyond base hardware specs. Key criteria include supply chain resilience, long-term radiometric drift stability, hardware customization flexibility, and regulatory compliance.
| Procurement Pillar | Technical Specification Requirement | Dianyang Tech Strategic Solution |
|---|---|---|
| Detector Architecture | Uncooled VOx Microbolometer, 8-14μm Spectral Range | High-yield Vanadium Oxide (VOx) focal plane arrays delivering optimal NETD performance over Silicon Amorphous (a-Si) alternatives. |
| Radiometric Precision | ±2°C or ±2% Reading Accuracy across Full Operational Span | Multi-point blackbody temperature calibration across ambient operating ranges (-10°C to +50°C) with real-time temperature compensation algorithms. |
| Form Factor & Interface | Compact Module Size, DVP / USB / SPI / MIPI / UART Interfaces | Flexible connector pinouts designed for rapid hardware embedded integration with minimal PCB redesign. |
| Software Ecosystem | Full Radiometric Matrix Output (Raw Data), Cross-Platform SDKs | Complete API SDKs providing pixel-by-pixel temperature array data, custom color palettes, and point/line/area thermal calculation nodes. |
| Export Compliance | Non-ITAR Classification, CE, FCC, RoHS, REACH Certification | 100% ITAR-free design manufactured in ISO-certified facilities, ensuring friction-free international export and customs clearance. |
The infrared thermal imaging landscape is undergoing a massive transformation driven by advancements in semiconductor packaging, optical miniaturization, and artificial intelligence at the edge. Dianyang Technology's R&D roadmap focuses on pushing the boundaries of spatial resolution, thermal sensitivity, and multi-spectrum fusion.
By transitioning from traditional 17μm detectors to 12μm microbolometers and next-generation sub-10μm architectures, we significantly reduce the required focal length and physical size of Germanium optics. This dramatically lowers system cost and total module weight while increasing spatial detail.
Modern industrial automation demands instant on-core analytics. Our upcoming module series embeds deep-learning neural network accelerators directly on the thermal processor board, enabling autonomous hot-spot detection, optical arc recognition, and target classification without overloading external host CPUs.
Fusing visible light RGB sensors with long-wave infrared spectral streams allows high-definition spatial edge overlay on thermal signatures (similar to our DP-25DR and DP-12DV series). This hybrid perception provides operators with instantaneous situational awareness and precise physical component identification.
Dianyang Technology's OEM modules and finished handheld thermal imagers serve critical infrastructure, industrial electronics, civil engineering, and security ecosystems around the globe.
Substation transformers, high-voltage transmission lines, and distribution panels are vulnerable to phase imbalance and loose connection heating. Models like the DP-38D (384x288) and DP-64D (640x512) offer high spatial resolution and integrated laser ranging for long-distance utility inspections, detecting abnormal resistance thermal signatures prior to catastrophic equipment failure.
In semiconductor manufacturing and circuit board prototyping, thermal dissipation is a primary failure vector. Dianyang’s high-frequency thermal analyzers and handheld modules enable hardware engineers to map micro-watt energy leaks, component short-circuits, and thermal throttling in IC packages with sub-millimeter detail.
Infrared inspection provides non-destructive evaluation of building envelopes. OEM cores integrated into handheld diagnostic tools enable inspectors to visualize thermal bridges, hidden moisture accumulation, air leakage paths, and underfloor heating pipe blockages with precision temperature range scale settings (-20°C to +550°C).
Night vision driver assistance systems rely on LWIR sensors to detect pedestrians, wildlife, and road obstacles beyond the range of standard LED headlights and through dense fog or smoke. OEM module integration into automotive headlamps and windshield housings enhances active safety capabilities.
Radiometric modules tuned for biological temperature bounds yield fast, non-contact human core body temperature measurement. Applied in mass transit hubs, healthcare facilities, and mobile phone attachments (such as the H2FB and H1FB series), providing rapid fever screening without physical contact.
In smoke-filled environments, optical cameras fail completely. High-durability thermal imaging modules allow firefighters to locate structural hot-spots, navigate zero-visibility rooms, and locate trapped victims efficiently through dual-light fusion rendering.
Shenzhen Dianyang Technology Co., Ltd. is a subsidiary of VHD (Shenzhen VHD Technology Co., Ltd.), a publicly listed company on the Shenzhen Stock Exchange. This strategic affiliation gives Dianyang unique access to VHD’s advanced R&D platforms, high-precision manufacturing systems, and rigorous quality management practices—enabling us to deliver thermal imaging products of higher reliability and consistency than typical ODMs.
We specialize in ODM/OEM services for infrared thermal imaging solutions, including handheld thermal imagers, smartphone-connected thermal cameras, thermal analyzers, and thermal imaging telescopes. Our products serve global customers in power inspection, building diagnostics, firefighting, industrial maintenance, and outdoor applications.
Our dedicated engineering team applies Design for Manufacturing (DFM), Design for Testability (DFT), thermal simulation, and EMC pre-compliance analysis to optimize performance and accelerate development. We also support clients in obtaining key certifications such as CE, FCC, RoHS, REACH, CB, UKCA, KC, and PSE.
Deploying thermal technology on a global scale requires strict adherence to regional electronic, environmental, and radio frequency regulations. Dianyang Tech provides end-to-end compliance engineering support, ensuring your OEM products pass overseas market barriers smoothly.
Fully compliant with European Health, Safety, and Environmental protection standards for electromagnetic compatibility (EMC) and low-voltage electrical safety.
Tested and validated for digital emission compliance across North America (FCC Part 15) and Japanese electrical safety requirements (PSE & MIC certification).
100% hazardous substance-free design, ensuring compliance with European Union directives on hazardous chemical substances in electrical components.
Certified for South Korean industrial markets (KC) and backed by CB international test certificates for rapid cross-border safety recognition.
Get direct technical answers from our engineering team regarding OEM sensor module integration, customization workflows, and radiometric performance parameters.
Browse our extended product portfolio featuring high-resolution handheld systems, dual-light inspection cameras, and compact mobile imaging attachments.
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